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Flagship program
3D IC Technology and Application
o Focus: TSV and Thermal cooling for advanced multicore computing and BCI
o Agenda
- Q1 2010 Kickoff
- Q1 2010: Template IP contract, in progress (MNS)
- Q2 2011: First joint TSV with thermal cooling silicon demonstrator
- Q1 2010: Template IP contract, in progress (MNS)
- Q2 2011: First joint TSV with thermal cooling silicon demonstrator
o Joint funding need to be secured before Q2 2010 (AJ, YL)
o Announcement in D43D 2010
- Q2 2012: Long-term cooperation funded actions
o Low power Exascale 3D computing
o Advanced BCI implant joint demonstrator
o Advanced BCI implant joint demonstrator